Samsung's fourth-generation high-bandwidth memory 'HBM3' chip passes NVIDIA testing, to be installed in 'H20' for the Chinese market
It has been reported that Samsung's fourth-generation
Exclusive: Nvidia clears Samsung's HBM3 chips for use in China-market processor | Reuters
https://www.reuters.com/technology/nvidia-clears-samsungs-hbm3-chips-use-china-market-processor-sources-say-2024-07-23/
HBM is a type of DRAM standard developed in 2013 that saves space and power by stacking chips vertically. In recent years, with the rise of generative AI, the demand for HBM has been expanding along with the rapid increase in demand for high-performance GPUs. Therefore, it is very important for memory manufacturers to pass the tests of NVIDIA, which has the largest share in the GPU market for AI.
Until now, Samsung has brought its DRAM 'HBM3' and 'HBM3E' to NVIDIA for testing to see if they can withstand use in AI processors. However, in May 2024, it was reported that Samsung's DRAM had failed due to heat and power consumption issues. At the time, Samsung denied the reports, saying, 'The allegation that our products are stumbling due to heat or power consumption is not true. Testing is proceeding smoothly as planned.'
Now, Reuters has reported that Samsung's HBM3 has passed NVIDIA's tests, but some sources say that Samsung's HBM3E still doesn't meet NVIDIA's standards and testing is still ongoing.
Although HBM3 passed NVIDIA's tests, it will not be installed in the flagship AI chips sold by NVIDIA, but will be installed in the H20, a GPU for the Chinese market with reduced performance to avoid U.S. export restrictions . According to a source, the installation of HBM3 in the H20 will begin as early as August 2024.
Neither NVIDIA nor Samsung has commented on the report.
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in Hardware, Posted by log1r_ut