Apr 26, 2024 17:32:00

It is revealed that Huawei is aiming to produce high-bandwidth memory with government support

A consortium led by Chinese manufacturer Huawei is seeking to start production of high-bandwidth memory (HBM), a key component of AI chips, in 2026, with government support.

Huawei Leads Chinese Effort to Compete With Nvidia's AI Chips — The Information

https://www.theinformation.com/articles/huawei-leads-chinese-effort-to-compete-with-nvidias-ai-chips

Huawei-led Chinese firms aim to make advanced memory chips by 2026, The Information reports | Reuters
https://www.reuters.com/technology/huawei-led-chinese-firms-aim-make-advanced-memory-chips-by-2026-information-2024-04-25/

China aims to break free from Western tech reliance with high-bandwidth memory chip push
https://the-decoder.com/china-aims-to-break-free-from-western-tech-reliance-with-high-bandwidth-memory-chip-push/

It is known that China has built a self-sufficient semiconductor manufacturing network within the country, overcoming economic sanctions imposed by the United States.

Huawei is building a self-sufficient chip network to overcome US sanctions - GIGAZINE

Regarding AI chips, as of 2022, NVIDIA and AMD are subject to

export bans to China , and it has been reported that Chinese companies are obtaining NVIDIA chips by purchasing servers from resellers.

It has become clear that China has acquired NVIDIA AI chips that were supposed to be banned by the US from Dell, Gigabyte and Supermicro servers - GIGAZINE

HBM enables high-speed data transfer while consuming less power than DDR memory and other memory devices, but it is much more difficult to manufacture, and only three companies in the world manufacture it: SK Hynix of South Korea, Samsung Semiconductor, and Micron Techology of the United States.

Although HBM itself is not subject to the embargo, there are some manufacturing techniques that Huawei is prohibited from accessing.

According to a report from the news site The Information, the HBM production plan in China is scheduled to start in 2023, and in addition to Huawei, Fujian Jinhua Integrated Circuit, which is on the US entity list, is also participating.

The consortium will set up at least two manufacturing lines that will compete internally, with the HBM produced being primarily purchased by Huawei.