Samsung's high-bandwidth memory 'HBM3' and 'HBM3E' fail NVIDIA's AI processor tests due to heat and power consumption issues
Reuters has reported that tests have shown that Samsung's fourth-generation
Exclusive: Samsung's HBM chips failing Nvidia tests due to heat and power consumption woes | Reuters
https://www.reuters.com/technology/samsungs-hbm-chips-failing-nvidia-tests-due-heat-power-consumption-woes-sources-2024-05-23/
According to a person familiar with the issue, the problems with Samsung's HBM3, which has problems with heat and power consumption, will also affect the fifth-generation HBM, 'HBM3E,' which is expected to be released to the market in 2024.
In response to the news, which was exclusively published by Reuters, Samsung denied the report, saying, 'The allegations that our products are stumbling due to heat or power consumption are untrue. Testing is proceeding smoothly as planned.' Nvidia declined to comment.
HBM is a type of DRAM standard developed in 2013 that saves space and power by stacking chips vertically. Demand for HBM is skyrocketing as demand for high-performance GPUs surges due to the boom in generative AI.
Therefore, meeting the expectations of NVIDIA, which accounts for approximately 80% of the global AI GPU market, is considered extremely important for memory manufacturers in terms of both profits and face-saving.
Samsung has been trying to pass Nvidia's tests for HBM3 and HBM3E since 2023, three people familiar with the matter told Reuters, and two of the people said Samsung's 8-layer and 12-layer HBM3E failed the tests in April 2024.
It is unclear whether the reason for the failure is something that can be fixed immediately, but sources said, 'There is growing concern among the industry and investors that Samsung's failure to meet NVIDIA's requirements will put it further behind rivals SK Hynix and Micron Technology in the HBM field.'
In contrast to Samsung's struggles, SK Hynix has been supplying HBM3 to NVIDIA since June 2022, solidifying its position as a major supplier of HBM chips. It also began shipping HBM3E in March 2024, to an undisclosed destination, one of the sources said, which is NVIDIA.
SK Hynix was the first manufacturer to develop HBM chips in 2013, and has invested more time and resources than Samsung, which has led to its technological advantage in HBM. Samsung's rival Micron Technology also plans to supply HBM3E to NVIDIA.
Industry analysts say Samsung's decision to replace its semiconductor division chief on May 21, 2024, is a move that underscores the company's growing frustration with HBM delays.
'The market expected that Samsung, the world's largest memory maker, would pass NVIDIA's tests right away, but it's natural that a specialized product like HBM takes time to meet customer performance evaluations,' said Jeff Kim, head of research at KB Securities in South Korea.
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