Rapidus, a Japanese semiconductor manufacturer aiming to produce 2nm semiconductors domestically, has begun installation of ASML's mass production-compatible EUV exposure tool 'NXE:3800E'
Rapidus begins installation of Japan's first mass production-compatible EUV exposure tool, the NXE:3800E, at IIM - Rapidus Corporation
https://www.rapidus.inc/news_topics/news-info/rapidus%E3%80%81%E6%97%A5%E6%9C%AC%E3%81%A7%E5%88%9D%E3%82%81%E3%81%A6%E9% 87%8F%E7%94%A3%E5%AF%BE%E5%BF%9Ceuv%E9%9C%B2%E5%85%89%E8%A3%85%E7%BD%AEiim%E3%81%B8%E3%81%AE%E8%A8%AD%E7%BD%AE%E4%BD%9C/
Rapidus is first Japanese company to install ASML's cutting-edge EUV machine — chipmaking tool for 2nm chips expected to be operational this year | Tom's Hardware
https://www.tomshardware.com/tech-industry/semiconductors/rapidus-is-first-japanese-company-to-install-asmls-cutting-edge-euv-machine-chipmaking-tool-for-2nm-chips-expected-to-be-operational-this-year
Rapidus was founded in 2022 with 7.3 billion yen in investment from major companies such as Toyota, Denso, Sony, NTT, NEC, SoftBank, Kioxia, and Mitsubishi UFJ Bank, based on the recognition that domestic production of cutting-edge semiconductors is important for Japan's industry and security.
Rapidus will begin construction of a new factory, ' IIM-1 ,' in Chitose, Hokkaido, in 2023 to develop and produce cutting-edge semiconductors, and the Japanese government announced in April 2024 that it had approved a subsidy of 590 billion yen. The total amount of support from the Japanese government to Rapidus has reached 920 billion yen.
The Japanese government announced that it will support Rapidus, which aims to build a cutting-edge LSI foundry of 2nm or less, with 590 billion yen - GIGAZINE
On December 18, 2024, Rapidus announced that it had delivered ASML's mass production EUV exposure tool 'NXE:3800E' to IIM-1 and started installation work. EUV lithography is one of the key technologies for realizing 2nm semiconductors, and the NXE:3800E is a cutting-edge EUV exposure tool designed to manufacture 2nm and even smaller semiconductors.
The NXE:3800E is a huge device weighing 71 tons and standing 3.4 meters tall, and will need to be assembled in four stages. Rapidus plans to complete the installation work by December, and will begin operating the 2nm process pilot line at IIM-1 in April 2025, with commercial semiconductor production scheduled to begin in 2027.
The introduction of this EUV exposure tool will be an important milestone in Rapidus' 2nm process semiconductor manufacturing. Technology media Tom's Hardware stated that although Rapidus will be 1.5 to 2 years behind Intel and TSMC in mass production of 2nm semiconductors, it will be a breakthrough for the Japanese semiconductor industry.
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