SK Hynix Announces Partnership with TSMC to Develop Next-Generation HBM4 Chips and Advanced Chip Packaging Technologies for Mass Production in 2026
On April 19, 2024, South Korean semiconductor supplier
SK hynix Partners With TSMC to Strengthen HBM Leadership
https://news.skhynix.com/sk-hynix-partners-with-tsmc-to-strengthen-hbm-technological-leadership/
SK Hynix and TSMC Team Up for HBM4 Development
SK Hynix partners with TSMC to develop advanced AI chips - Nikkei Asia
https://asia.nikkei.com/Business/Technology/SK-Hynix-partners-with-TSMC-to-develop-advanced-AI-chips
SK hynix joins TSMC to produce High Bandwidth Memory 4
http://www.theinvestor.co.kr/view.php?ud=20240419050608
Unlike conventional memory chips, HBM has an extremely high processing speed and is essential for computing technology using generative AI. SK Hynix holds approximately 50% of the HBM market share. In addition, TSMC, which produces approximately 92% of the world's advanced chips, is developing advanced packaging technology that enables efficient collaboration between HBM chips and GPUs. Both companies are major suppliers to NVIDIA, the leader in the AI chip market.
To date, SK Hynix has supplied NVIDIA with HBM3 chips, with more advanced HBM3e chips scheduled to ship in 2024. Through this partnership, SK Hynix and TSMC will jointly develop 'HBM4,' the sixth-generation HBM scheduled for mass production in 2026. Justin Kim, president and head of AI infrastructure at SK Hynix, said, 'Our strong partnership with TSMC will accelerate our open collaboration efforts with customers and we look forward to developing the industry's best performing HBM4.'
SK Hynix and TSMC have also signed a partnership agreement in the field of packaging technology, and will advance technological development to optimize TSMC's packaging process technology,
The partnership between SK Hynix and TSMC will enable HBM4 to use TSMC's advanced logic process technology to build a base die to pack additional features and I/O pins into existing space constraints. It will also enable customers to meet a wide range of performance and power efficiency requirements. TSMC COO Kevin Chang said, 'TSMC and SK Hynix have built a strong partnership for many years. Together, we will integrate cutting-edge logic and HBM to build world-leading AI solutions. Looking ahead to the next generation of HBM4, we will continue to work closely together to provide our users with the best integrated solutions.'
'SK Hynix's deepening collaboration with TSMC is a smart move, as the company has many customers working on cutting-edge AI chip development,' said Allen Chen, a chip analyst and director at PricewaterhouseCoopers' Center for High-Tech Industry Research. 'If SK Hynix is successful in securing additional partnerships, we're likely to see even more customers using its HBM.'
In the HBM field, Samsung, the second largest market share holder, is also expanding its business, announcing in February 2024 that it had developed its own HBM3e chips, and NVIDIA has reported that it has 'certified Samsung's HBM chips for use in its own products.'
Samsung announces ultra-high-speed memory 'HBM3E 12H' with a transfer speed of 1280GB/s and a capacity of 36GB, enabling faster AI learning and increased parallel execution of inference - GIGAZINE
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