Report that TSMC is considering building a semiconductor packaging factory in Japan

TSMC, the world's largest semiconductor manufacturer, is proceeding with plans to construct semiconductor factories in Kumamoto, Japan, and Arizona, USA. It has been reported by overseas media Reuters that TSMC is considering building a facility in Japan that will handle the back-end processes of semiconductor manufacturing. On the other hand, in the United States, it has been reported that there are delays in building the supply chain related to TSMC's factories.

Exclusive: TSMC considering advanced chip packaging capacity in Japan, sources say | Reuters
https://www.reuters.com/technology/tsmc-considering-advanced-chip-packaging-capacity-japan-sources-say-2024-03-17/

TSMC, Intel suppliers delay US plants on surging costs, labor crunch - Nikkei Asia
https://asia.nikkei.com/Business/Technology/TSMC-Intel-suppliers-delay-US-plants-on-surging-costs-labor-crunch

◆ Considering construction of a production base for back-end processes in Japan
The semiconductor manufacturing process is divided into the ``front-end process,'' in which circuits are formed on silicon wafers, and the ``back-end process,'' in which the silicon wafer is cut into pieces and chips are assembled.Generally, the front-end process and the back-end process are carried out in different factories. You can In Kumamoto , construction of TSMC's first factory has been completed and construction plans for the second factory have begun, and it has been decided that both will be in charge of front-end processes.

Taiwanese chip maker 'TSMC' announced that it will build a second factory in Japan and start operations by the end of 2027, with a total investment of approximately 3 trillion yen and the first factory scheduled to start mass production in the fourth quarter - GIGAZINE

by IBM Research

According to new information obtained by Reuters from people involved, TSMC is considering building a semiconductor packaging facility in Japan. The study is in the early stages, and the scale and construction date of the packaging facility have not yet been determined.

Furthermore, TSMC is also focusing on post-process technology development, such as establishing the `` TSMC Japan 3DIC Research and Development Center '' in Tsukuba City and developing the packaging technology `` 3DFabric ''.

◆Delays in building the U.S. semiconductor supply chain
TSMC is also building a semiconductor factory in Arizona, USA. The Arizona factory was originally scheduled to start operations in 2024, but in July 2023, the start date was postponed to 2025 due to labor shortages.

TSMC's Arizona factory, which aims to manufacture iPhones and AI chips, postpones production start date due to ``labor shortage'' - GIGAZINE

In Arizona, chemical manufacturers such as LCY Chemical, Solvay, Chang Chun Group, KANTO-PPC, and Topco Scientific are building production facilities related to TSMC's semiconductor fab. However, according to information obtained by Nikkei Asia from related parties, each production base has been forced to significantly postpone the start of operations or downsize. An official said, ``The cost of building a production base in Arizona is four to five times that of Asia,'' and ``The cost has jumped several times higher than the preliminary estimate.''

In addition, Intel is also building a semiconductor factory in Arizona, but according to officials, Intel's factory construction is also slower than previously expected.