Intel succeeds in testing the backside power supply technology 'PowerVia' that restarts 'Moore's Law', Intel appeals 'going two years ahead of rivals' and 'stop making pizza'

Intel reported that it has successfully implemented a test implementation of the backside power supply technology `` PowerVia '' that contributes to improving the transistor density of CPUs. With the development of PowerVia, it is said that Intel has approached the realization of the goal of 'packing 1 trillion transistors in one package by 2030'.

With PowerVia, Intel Achieves a Chipmaking Breakthrough

What is PowerVia?

Read how Intel developed and proved the world's first backside power solution, taking a major step forward in chipmaking: https://t.co/aWKT8OL8iL pic.twitter.com/8mtpq6REUi

— Intel News (@intelnews) June 5, 2023

The CPU transistors that are in circulation at the time of writing the article are produced in a method similar to pizza making, in which transistors and wiring are stacked in order from the bottom. With the current CPU, there was no problem with the pizza-making method, but with the progress of chip miniaturization, the power supply system was becoming the bottleneck of the processing system.

In order to eliminate the CPU bottleneck, chip makers are developing 'backside power supply technology' that mounts the power supply system on the back side of the chip. Intel is also developing the back power supply technology 'PowerVia', and on June 5, 2023, the successful test of introducing PowerVia technology to the Efficient Core (E core) of the CPU 'Meteor Lake' under development was announced. it was done. Intel describes the development of PowerVia as 'stop making pizza', citing the structure of conventional CPUs.

CPUs using PowerVia will increase power efficiency and improve transistor density. Regarding the improvement of transistor density by PowerVia, Intel said, ``The promise of Moore's Law has been realized again. will be.”

Intel plans to announce details of PowerVia at the 'VLSI Symposium' to be held in Kyoto from June 11 to 16, 2023.

VLSI Symposium | Symposium on VLSI Technology and Circuits
https://www.vlsisymposium.org/