Nov 10, 2020 14:00:00

Micron Ships 176 Layers of 3D NAND Flash Memory

American semiconductor manufacturer

Micron Technology has announced that it will ship the world's first '176-layer 3D NAND flash memory.'

176-Layer NAND
https://www.micron.com/products/nand-flash/176-layer-nand

Doing What Can't Be Done (Again) – Micron Ships 176-Layer NAND
https://www.micron.com/about/blog/2020/november/doing-what-cant-be-done-again-micron-ships-176-layer-nand

Micron Announces 176-layer 3D NAND
https://www.anandtech.com/show/16230/micron-announces-176layer-3d-nand

Micron steals a march on rivals with 176L 3D NAND shipments – Blocks and Files
https://blocksandfiles.com/2020/11/09/microns176l-3d-nand/

Micron is in the process of hiding technical details about 176-layer 3D NAND flash memory, but in this announcement, it said, 'The size of the 512Gbit die has been reduced by up to 30% compared to competing products, and the open NAND flash interface (ONFI) bus. Achieved 1600 MT / s by. ' These two technological advances report more than 35% higher read / write latency and 15% better mixed workloads compared to their 96-layer 3D NAND.

The 3D NAND Substitution Gate (RG) technology adopted from 128-layer 3D NAND has been significantly involved in this technological advancement. In this 176-layer 3D NAND, RG technology reduces resistance in metal control gates to improve the problem of capacitive coupling between cells, and is a high-capacity data storage system with fast, smooth and high-performance performance. It is written that it was possible to realize.

Production of the 176-layer 3D NAND announced this time has already started, and Crucial and others will be installed in consumer SSDs scheduled to be released in 2021. SSDs with Micron 176-layer 3D NAND have not been announced at the time of writing, so shipments of 176-layer 3D NAND in 2020 are expected to be 'quite few', but will be current by 2021. It is reported that there will be a shift from 128-layer 3D NAND to 176 layers.

Major 3D NAND manufacturers Samsung, SK Hynix, and YMTC are still at the 128-layer stage, and Samsung has announced that it will reach 176 layers by April 2021. With this 176-layer 3D NAND shipment, Micron is reported to be one step ahead of its competitors.