Intel officially announces TDP7W mobile product ``Lakefield'', whether ARM approaches the stronghold
Details of Intel's hybrid processor '
Intel® Core™ Processors with Intel® Hybrid Technology Product Specifications
https://ark.intel.com/content/www/us/en/ark/products/series/202779/intel-core-processors-with-intel-hybrid-technology.html
Intel Hybrid Processors: Uncompromised PC Experiences for Innovative Form Factors Like Foldables, Dual Screens | Intel Newsroom
https://newsroom.intel.com/news/intel-hybrid-processors-uncompromised-pc-experiences-innovative-form-factors-foldables-dual-screens/#gs.7soafh
Intel Discloses Lakefield CPUs Specifications: 64 Execution Units, up to 3.0 GHz, 7 W
https://www.anandtech.com/show/15841/intel-discloses-lakefield-cpus-specifications-64-execution-units-up-to-30-ghz-7-w
Intel's 3D-stacked Lakefield chips are here to take on ARM in laptops, tablets, and foldables-The Verge
https://www.theverge.com/circuitbreaker/21285821/intel-3d-stacked-lakefield-chips-hybrid-core-atom-arm-processor
At Lakefield, the 3D packaging manufacturing technology ' Foveros ' that stacks CPU, GPU, memory, etc. three-dimensionally has made it possible to downsize the board and reduce power consumption during standby.
A movie that allows you to visually understand the structure of Lakefield has also been released.
What is in the box labeled 'LAKE FIELD' is...
A lot of blocks. Each of these blocks is a component of Lakefield.
Building blocks...
The first part to be assembled is the package part including various controllers such as storage, audio, USB, and PCIe. With normal architecture, the components that are mounted on the motherboard are included in the package at Lakefield.
Then the SoC part was assembled. In Lakefield, performance is achieved by adopting a hybrid structure that combines the 10 nm process '
Lakefield's DRAM is also mounted inside the package, so the board can be made even smaller. The DRAM installed is LPDDR4X-4266, and a faster controller than Ice Lake's LPDDR4X-3733 is adopted. In this way, the package part, SoC part, and DRAM part were completed.
Finally, stack each part in the order of package part, SoC part, DRAM part...
The completed Lakefield package. Foveros is a technology for mounting each component by stacking in this way.
The actual board on which Lakefield is mounted looks like this.
The Lakefield models announced by Intel this time are 'Core i5-L16G7' and 'Core i3-L13G4', and both have a TDP of 7W. The power consumption during standby is 2.5 mW, which is a 91% reduction compared to 'Core i5-8500Y' which is Intel's mobile model. Although it is a low power consumption model, the clock frequency at Turbo Boost has reached 3.0 GHz, the single thread performance is up to 12% compared to the Core i5-8500Y, and the performance per SoC power consumption is up to 24%. .. In addition, the built-in GPU will be the 11th generation, 53% faster video conversion compared to the 9th generation, and Intel can secure up to 4 4K outputs.
According to technical media AnandTech , it has been announced that the TDP is 7 W, but the actual power consumption limit has not been revealed. Also, at Lakefield, most of the processing is done by Tremont core, and only the processing related to the user such as typing and screen operation is done by Sunny Cove.
Intel will release additional information for the press on June 11, 2020. Lakefield has already been announced to be used on Surface Neo and Lenovo's ThinkPad X1 Fold , and is scheduled to be released in the second quarter of 2020.
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