It turns out that Intel manufactures chips for iPhone or has 1000 personnel staff

ByJosh Bancroft

To Apple's next iPhone "iPhone 7 (tentative name)" expected to appear in 2016, Intel's LTE compatible modem chip "XMM 7360The possibility that it will be equipped has increased. Intel has launched a development team with a scale of 1000 people to develop this chip and the possibility of handling more important SoCs has emerged depending on the circumstances.

Intel has 1,000 people working on chips for the iPhone | VentureBeat | Mobile | by Mark Sullivan
http://venturebeat.com/2015/10/16/intel-has-1000-people-working-on-chips-for-the-iphone/

Technology-related news mediaVentureBeatAccording to information from industry stakeholders, Intel said that it is in place to supply LTE communication modem chip for Apple 's new iPhone, which is expected to appear in 2016. It has already been found that close relationships are being taken, such as the transfer of employees from 1000 employees to the company, as well as the transfer of important developers from Apple to Apple.

Although iPhone 6s / 6s Plus is equipped with Qualcomm's modem chip on every terminal, Apple is expected to be receiving a supply from multiple suppliers in the future, this report supports it It is likely to become something. The new iPhone seems to be equipped with LTE chips made by Qualcom and Inte, but it is unclear to what extent you will supply it.

Intel's CEO Brian Kruzanich is at the performance presentation meeting, and 7360 LTE chips will be shipped by the end of the year, and we will reveal that products with that chip will appear next year.


The Intel XMM 7360 which is adopted for iPhone is compatible with the LTE Cat. 9 and Cat. 10 standards,Up to 450 Mbps downlink communication speedIt corresponds to LTE communication modem chip. It was announced at Mobile World Congress 2015 (MWC 2015), the world's largest mobile technology exhibition held in Barcelona, ​​Spain in March 2015.

Intel® XMM ™ 7360 Modem Platform Brief
http://www.intel.com/content/www/us/en/wireless-products/mobile-communications/xmm-7360-brief.html


The possibility of Intel chip already reported in March 2015, and this report is believed to indicate that this movement is progressing steadily.

IPhones will ship with Intel LTE chips inside in 2016 | VentureBeat | Mobile | by Mark Sullivan
http://venturebeat.com/2015/03/10/iphones-will-ship-with-intel-lte-chips-inside-in-2016/

Furthermore, according to industry stakeholders, Apple seems to be considering introducing SoC that integrates both iPhone's Ax processor and LTE modem chip. It is reported that SoC's design is done by Apple in-house and that LTE modem technology is considering licensing from Intel.

It is also said that Intel is in charge of manufacturing this SoC using the company's 14 nm manufacturing process. On the iPhone 6s seriesSamsung and TSMC are in charge of manufacturing A9 chips, But both are based on the 20 nm process rule, Intel's 14 nm process rule is expected to enable a higher degree of integration beyond this. Furthermore, as Intel also considers manufacturing with the 10 nm process rule, it seems that Apple is showing high interest.

Intel's 7360 chip was developed at the Intel facility in Munich, Germany. This facility, owned by modem maker Infineon, was used as Intel's research facility since Intel acquired Infineon in 2011. Infineon was supplying 3G modem to the iPhone until 2011, which is acquired by Intel.

Engineers move seems to be active between the two companies, Apple's engineers visited Munich to advance the optimization of 7360 chips, and important developers from Intel also work closely with Apple to develop It seems to be going. It is said that some of the key staff are in a position to deal with Apple's confidential matters and are working from Intel to Apple.

Regarding the device mounted on the iPhone,Samsung and TSMC slightly different A9 chip performanceSince news has been reported only, it is likely to attract attention to what kind of device Qualcomm will be putting in the same position as Intel.