"MacBook Air" A report broken down comparing the 2013 model with the 2012 model

Apple held on June 11, 2013Presented in developer event WWDC 2013A new MacBook Air model has been released at iFixit that got it all apart and disassembled apart. The feature of this new model is equipped with Intel 's architecture for Ultrabook "Haswell ULT", where the battery duration has been extended. How is the structure changed compared to the 2012 model that has been sold so far?

MacBook Air 13 "Mid 2013 Teardown - iFixit
http://www.ifixit.com/Teardown/MacBook+Air+13-Inch+Mid+2013+Teardown/15042/1

So we prepared a MacBook Air 13 "model for disassembly.


The model number is "Model A 1466", the exterior and model name are the same as those sold in 2012.


The arrangement of ports on the right side of the main unit is the same.


However, the left side has slightly changed appearance because the hole for the dual microphone is empty.


Start decomposing without hesitation, remove screws at the bottom of the main unit.


The bottom panel broke away.


The left is the 2012 model, the right is the 2013 model. Surrounded by a red frame is an SSD module, slightly smaller. The inside of the orange frame is an AirPort card, it has been changed to a new one. Heat sink in green frame. According to the person who was in charge of disassembly according to the person who was in charge of disassembly, the detailed procedure is quite extensive, "If you think you want to do, you can continue looking for fault even one day, but let's advance the disassembly of the new machine" to the next procedure.


To remove the battery quickly remove two screws simultaneously to increase efficiency


And the removed battery unit. The 2012 model used the one of 6700 mAh (7.3 V), but in 2013 model the capacity increased to 7150 mAh (7.6 V), realizing 12 hours driving.


Next, I put hands on built-in storage.


In the storage that increased speed by 45% compared with the past, Samsung's S4LN053X01-8030 (within the red frame) and Samsung K9LDGY8SIC-XCK0 16GB flash storage (within the orange frame) are installed as Flash controllers.


The memory is 512 MB of Samsung K4P 2 G 324 ED (in yellow frame)Raspberry PiSame as used in. Previously I was using the Toshiba SATA module listed under the photo, but from this model it has been changed to a PCIe based SSD, the size has also changed, compatible with previous MacBook Air parts Sex is gone.


For Wi-Fi connection, 802.11ac was newly supported, but this new AirPort card realizes that.


This L-shaped parts are stereo speakers


It seems that this is the same as the 2012 model.


The I / O board is the same as the 2012 model except that the iSight socket is gone.


The 2012 model was a single microphone, but the 2013 model is a dual microphone.


Finally to the center. First remove the logic board ......


Heat sink also removed.


Looking at the logic board, the dual-core Intel Core i5 processor 1.3 GHz and Intel HD graphics 5000 are in the red frame.


Behind it, Elpida's F8132A 1 MC LPDDR 3 RAM 4 GB in the red frame.


Also remove the trackpad that remained on the main unit.


Track pad controllers etc are stuffed in parts that are hidden in the main body and are not normally visible.


This completes the disassembly. The easiness of decomposition (the lower the harder it is), it is safe not to rose unless there is so much about 4 in 10 steps.