Samsung enters final adjustment stage for supplying high-speed memory 'HBM4' to NVIDIA, aiming to start mass production in February 2026

Multiple media outlets have reported that Samsung is in the final stages of negotiations with NVIDIA to begin mass production of its high-bandwidth memory, HBM4.

Samsung to start production of HBM4 chips next month for Nvidia supply, source says | Reuters
https://www.reuters.com/world/asia-pacific/samsung-start-production-hbm4-chips-next-month-nvidia-supply-source-says-2026-01-25/

Samsung Nears Nvidia's Approval for Key HBM4 AI Memory Chips - Bloomberg
https://www.bloomberg.com/news/articles/2026-01-26/samsung-nears-nvidia-s-approval-for-key-hbm4-ai-memory-chips

HBM stands for High Bandwidth Memory, and is used in AI processing chips with high data exchange rates due to its extremely high speed communication capabilities. NVIDIA's Vera Rubin, which is scheduled to be released in the second half of 2026, will use the next-generation HBM4 standard, and Samsung has been developing it in time for Vera Rubin's plans.

NVIDIA announces next-generation AI-specialized GPU architectures 'Blackwell Ultra,' 'Vera Rubin,' and 'Rubin Ultra,' with Rubin delivering 900 times the performance of Hopper at just 3% the cost - GIGAZINE

According to information obtained by Reuters from sources, Samsung plans to begin mass production of HBM4 in February 2026. Bloomberg also reported that 'Samsung's HBM4 is close to receiving certification from NVIDIA and is scheduled to begin mass production in February 2026.'

Samsung's rival in the memory field, SK hynix, is also developing HBM4 and exhibited a 16-layer HBM4 at SEC 2026 held in early January 2026.

CES 2026: CEO Kwak Strenghtens AI Memory Partnerships
https://news.skhynix.com/sk-hynix-ceo-kwak-noh-jung-finds-way-forward-for-ai-memory-on-the-ground-at-ces-2026/