A new material that cools CPUs faster than any other CPU grease on the market has been developed, with the key being a combination of liquid metal and ceramic powder
A joint research team from Sichuan University and the University of Texas at Austin has developed a thermal conductive material that combines liquid metal and aluminum nitride. The newly developed material can efficiently dissipate heat from CPUs and other components, and has been confirmed to have overwhelmingly higher heat dissipation performance than commercially available CPU greases.
Mechanochemistry-mediated colloidal liquid metals for electronic device cooling at kilowatt levels | Nature Nanotechnology
Prof. Fu Qiang /Wu Kai's Team Made Progress in Colloidal Thermal Conductive Materials-Sichuan University
https://en.scu.edu.cn/info/1034/2344.htm
New Thermal Interface Material Could Cool Down Energy-Hungry Data Centers
https://cockrell.utexas.edu/news/archive/10078-new-thermal-interface-material-could-cool-down-energy-hungry-data-centers
Adding ceramic powder to liquid metal thermal paste improves cooling up to 72% says researchers | Tom's Hardware
https://www.tomshardware.com/pc-components/thermal-paste/adding-ceramic-powder-to-liquid-metal-significantly-improves-thermal-qualities-claim-university-of-texas-researchers
Proper cooling is necessary to maximize the performance of processors such as CPUs and GPUs. The type and size of the cooling device is important for cooling the processor, but the type of 'thermal conductive material placed between the processor and the cooling device' also plays a major role in cooling performance. For example, the PlayStation 5 has been a hot topic for using liquid metal as a thermal conductive material.
In large-scale facilities such as data centers for AI development, the amount of electricity used for cooling cannot be ignored. Therefore, the research team worked on developing a thermal conductive material that enables efficient and effective cooling.
The results of the experiment revealed that mixing aluminum nitride, a type of ceramic, with liquid metal dramatically improved thermal conductivity. The thermal resistance of the new material was 0.42-0.86m2 K/W, which was an order of magnitude better than the original material. In addition, the experiment showed that the material was able to dissipate 2760W of heat from a 16cm2 heat source.
Below is a graph showing the temperature transition when cooling a copper heat source using the new material (blue) and commercially available CPU greases '
According to the research team, the new material will reduce the energy required to cool the processor by 13%, which will reduce the overall energy consumption of the data center by 5%. At the time of writing, preparations are underway to carry out tests in a data center.
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