MediaTek announces new flagship SoC 'Dimensity 9400', with high AI performance and the ability to perform video generation and additional learning (LoRA) on-device
On October 9, 2024 local time, MediaTek announced its flagship SoC, the Dimensity 9400. This SoC is capable of delivering outstanding performance efficiency for the latest AI experiences, and boasts industry-leading AI, computing and gaming performance.
MediaTek | MediaTek Dimensity 9400
MediaTek's Dimensity 9400 Flagship SoC Offers Extreme Performance and Efficiency for the Latest AI Experiences | MediaTek
https://corp.mediatek.com/news-events/press-releases/mediateks-dimensity-9400-flagship-soc-offers-extreme-performance-and-efficiency-for-the-latest-ai-experiences
The Dimensity 9400 is built on the Arm v9.2 CPU architecture, with a 2nd generation All Big Core design that delivers a huge performance boost, and combined with a cutting edge GPU and NPU, it delivers extreme performance in a power efficient design.
It consists of one Cortex-X925 core running at 3.62GHz, three Cortex-X4 cores and four Cortex-A720 cores, delivering 35% faster single-core performance and 28% faster multi-core performance compared to the previous generation chipset, the Dimensity 9300. The Dimensity 9400 is manufactured on TSMC's second-generation 3nm process, making it up to 40% more power efficient than its predecessor, allowing users to enjoy longer battery life.
'The Dimensity 9400 furthers our mission to 'become an AI enabler,' supporting powerful applications that predict user needs and adapt to preferences, while advancing generative AI technologies with on-device LoRA training and video generation,' said Joe Chen, President of MediaTek. 'As our fourth generation flagship chipset, the Dimensity 9400 continues to build on our steady market share growth momentum and MediaTek's tradition of delivering flagship performance in the most efficient designs for the best user experience.'
The Dimensity 9400 is equipped with an 8th generation NPU, delivering industry-first generative AI performance. It is the first mobile chipset to offer on-device LoRA training, on-device high-quality video generation, and developer support for agentic AI. To enable users to take advantage of the latest agentic and generative AI applications, the Dimensity 9400 delivers up to 80% faster Large Language Model (LLM) prompt performance than the Dimensity 9300, while also being up to 35% more power efficient.
The Dimensity 9400 also integrates MediaTek's new Dimensity Agentic AI Engine (DAE) that transforms traditional AI applications into sophisticated agent AI applications. MediaTek works with developers to provide a unified interface between AI agents, third-party APKs and models that efficiently run both edge AI and cloud services. This streamlined approach allows models to work with a wide variety of third-party APKs, reducing development time and helping to introduce a new ecosystem of agent AI applications.
The GPU is the 12-core Arm Immortalis-G925 , which delivers up to 40% faster ray tracing performance compared to the previous generation for an ultra-immersive gaming experience. The Dimensity 9400 brings PC-level capabilities to smartphones with support for Opacity Micromap (OMM) for realistic effects. Compared to the Dimensity 9300, the GPU performance is 41% higher in peak performance while saving up to 44% in power, allowing users to enjoy gaming for longer. In addition, the Dimensity 9400 supports HyperEngine technology, jointly developed by MediaTek and Arm Accurate Super Resolution (Arm ASR), which delivers super resolution and superior image quality.
Additionally, the MediaTek Imagiq 1090 enables HDR video recording across the entire zoom range, allowing users to capture the perfect moment from afar. MediaTek's Smooth Zoom technology also makes it easy to capture moving subjects. Designed to minimize power consumption when taking photos and videos, it consumes up to 14% less power when shooting 4K60fps video compared to the Dimensity 9300.
Other additional features of the Dimensity 9400 include:
Updated 3GPP Release-17 5G modem with 4CC-CA and sub-6GHz performance up to 7Gbps
New 4nm Wi-Fi/Bluetooth combo chip with 7.3Gbps data rate performance and up to 50% lower power consumption than previous generation
- Supports Wi-Fi 7 tri-band MLO
-MediaTek Xtra Range TM 3.0 provides Wi-Fi coverage up to 30 meters
- 5G/4G dual SIM dual active, dual data capabilities provide users with more flexibility
Support for tri-fold smartphones gives smartphone manufacturers flexibility to design innovative new form factors
The first smartphones equipped with Dimensity 9400 are expected to be available on the market from the fourth quarter of 2024.
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