Intel announces plan to realize '1nm node' in 2027, automated factory by AI also
Intel has announced plans to launch a 14A process node, equivalent to 1.4nm, in 2026 and a 10A process node, equivalent to 1nm, in the second half of 2027. The company also aims to introduce collaborative AI 'Cobots' that produce together with humans into semiconductor factories.
Intel puts 1nm process (10A) on the roadmap for 2027, aiming for fully AI-automated factories with 'Cobots' | Tom's Hardware
Intel announced a roadmap that included Intel 14A at the 'Intel Foundry Direct Connect 2024' event for foundry operators held on February 21, 2024, but did not reveal the specific release date. did not.
According to the technology news site Tom's Hardware, Intel has incorrectly communicated the content of the presentation that will not be made public, and based on this, Tom's Hardware once again reported on Intel's plans to introduce the next process node.
According to the report, Intel will start mass production of 14A nodes in 2026. Additionally, it was newly revealed that the company plans to deploy 10A nodes in the second half of 2027.
The 'A' in Intel's naming convention stands for
So far, the details of the 10A node have not been revealed, but Intel CEO Pat Gelsinger said, ``The cutoff of the new node is about a 14% to 15% improvement.'' A similar level of improvement is expected over 14A.
Intel also relies heavily on automation in its foundries, with the ``10X Moonshot'' initiative focusing on automation, from capacity planning and forecasting to yield improvement and actual floor-level production operations. We plan to introduce AI into every step of the flow.
Intel Executive Vice President Keevan Esfarjani did not specify a timeline for automation, but said AI will impact every aspect of business in the future. Specific initiatives include the introduction of AI 'Cobot', a collaborative robot that can work alongside humans, and the automation of a wide range of manufacturing processes using robots.
Other initiatives at the event included Intel's efforts to increase packaging production capacity and ensure redundancy by geographically distributing chip manufacturing and packaging production capacity.
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