TSMC points out that ``semiconductor shortage will continue until around the end of 2024''
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The chairman of TSMC has revealed that semiconductor manufacturing is being significantly delayed due to bottlenecks in packaging, the final step in semiconductor manufacturing where materials are enclosed in a case that prevents physical damage and corrosion. High-bandwidth products optimized for AI are expected to be particularly affected.
TSMC warns AI chip crunch will last another 18 months • The Register
https://www.theregister.com/2023/09/08/tsmc_ai_chip_crunch/
TSMC says chip packaging shortage is constraining processor supply - SiliconANGLE
According to TSMC Chairman Mark Liu, the company's CoWoS (chip-on-wafer-on-substrate) packaging technology can only meet about 80% of demand; Production of some of the most advanced chips, particularly chips for high-bandwidth memory such as the AI-optimized NVIDIA H100 , has been significantly delayed.
NVIDIA H100 is a high-performance GPU that costs $ 40,000 (about 5.9 million yen), and is especially responsible for satisfying the high computing power required by generative AI such as large-scale language models (LLM). Although the product was announced in March 2022, some server manufacturers have revealed that they had to wait more than six months for it to arrive.
According to Liu, demand for CoWoS has nearly tripled in the past year, so the supply shortage will continue for some time, but the shortage is expected to be resolved within 18 months from September 2023.
TSMC has announced plans to build a $3 billion (approximately 440 billion yen) facility in Miaoli County, Taiwan, and expand packaging capacity.
The company also announced a new CoWoS technology called CoWoS-L, with plans to manufacture chips up to six times the size of existing chips.
TSMC Preps 6x Reticle Size Super Carrier Interposer for Extreme SiP Processors
https://www.anandtech.com/show/18876/tsmc-preps-sixreticlesize-super-carrier-interposer-for-extreme-sips
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