May 30, 2022 21:00:00

Google-sponsored 'Open MPW Program' that allows you to make your own chips for free has appeared, and if you send a blueprint, you will have the original chip at hand

The ' Open MPW Program ' developed by the chip design platform

Efabless with the support of Google is being held. If you create and submit a chip design drawing in open source, you will be given the chance to get the original chip for free, including manufacturing and transportation costs. The deadline is June 8, 2022.

efabless.com
https://efabless.com/open_shuttle_program

Semiconductor designers typically purchase a development kit called the 'Process Design Kit (PDK)' from the foundry to which they are asked to manufacture semiconductors, but PDKs are very expensive. Therefore, in 2020, Google will collaborate with semiconductor foundry ' SkyWater ' to release the industry's first open source PDK. In addition, Google will also invest in semiconductor company Efabless to provide a service called Multi-project wafer (MPW) to prototype chips using a technology called Multi-project wafer (MPW) that manufactures a mixture of multiple circuits on a single wafer. I was there.

Google supports a project to open source the 'PDK' required for semiconductor chip design --GIGAZINE

Now that the service has been realized, the Open MPW program has started, which is completely open source and open to anyone who meets the requirements of other programs.

Users attempting to design chips should design using the 130nm process PDK published by SkyWater and post it to the GitHub repository for the public release.

In addition, the project has several requirements, including the need to comply with Google's comprehensive language guidelines and use Efabless

Caravel -based test harnesses and pad frames. In order to actually get to production, you need to pass the pre-check tool of the Open MPW program and implement and pass the simulation test bench of the design integrated in Caravel.

The program will be closed on June 8, 2022, and will be completed and packed on August 30. It will be shipped to the designer on October 18, 2022. In this program, Google will cover the costs of manufacturing, packing, and shipping.