China's semiconductor manufacturing equipment investment from 2025 to 2027 is predicted to exceed 14 trillion yen, while South Korea and Taiwan will exceed 10 trillion yen and the United States will be on the 9 trillion yen scale
According to estimates released by an industry group for semiconductor manufacturing equipment, the largest-ever scale of investment is expected to take place worldwide over the three-year period from 2025 to 2027. It is predicted that capital investment will be active due to factors such as the expanding need for semiconductors accompanying the growing demand for AI.
Global Semiconductor Industry Plans to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years, SEMI Reports | SEMI
China, South Korea, Taiwan to spend most on chip equipment 2025-2027, industry body says | Reuters
https://www.reuters.com/technology/china-south-korea-taiwan-spend-most-chip-equipment-2025-2027-industry-body-says-2024-09-26/
According to estimates released by the industry group SEMI, there is a possibility that as much as $400 billion (approximately 57 trillion yen) will be invested worldwide in semiconductor manufacturing equipment and 300mm fab equipment over the three years from 2025. Major vendors of semiconductor manufacturing equipment include ASML, Applied Materials, KLA, and Tokyo Electron.
The driving force is the decentralization of semiconductor manufacturing plants and the increasing demand for semiconductors for AI. SEMI predicts that spending on 300mm fab equipment will reach $99.3 billion (approximately 14.1 trillion yen) in 2024, up 4% from the previous year, and reach $123.2 billion (approximately 17.5 trillion yen) in 2025, up 24% from the previous year, exceeding the $100 billion level for the first time, and will increase 11% from the previous year to $136.2 billion (approximately 19.4 trillion yen) in 2026 and 3% from the previous year to $140.8 billion (approximately 20 trillion yen) in 2027.
In particular, China is expected to step up its capital investment in line with its policy of self-sufficiency, and is predicted to invest more than $100 billion over the three years from 2025, maintaining its position as the world's top spender on 300mm fab equipment.
South Korea is expected to invest $81 billion over the next three years to further strengthen its dominance in memory, including DRAM, high-bandwidth memory, and 3D NAND flash, making it the second largest investor in semiconductor manufacturing equipment in the world. Following China and South Korea is Taiwan, which is expected to invest $75 billion in 300mm fab equipment, starting with cutting-edge logic below 3nm.
The United States is expected to invest $63 billion between 2025 and 2027, while Japan is expected to invest $27 billion. In particular, policy incentives to ease semiconductor supply concerns in these regions are expected to more than double capital investment over the next three years.
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