AMD releases new BIOS firmware 'AGESA PI 1.2.0.2' to improve performance and address some latency issues for Ryzen 9000 series
AMD has released a new BIOS firmware update for the Socket AM5 platform, AGESA PI 1.2.0.2 , which aims to improve performance for
September 2024 AMD Ryzen™ Desktop Processor Update... - AMD Community
https://community.amd.com/t5/gaming/september-2024-amd-ryzen-desktop-processor-updates/ba-p/714087
AMD improves Zen 5 CPU latency and performance with BIOS updates - The Verge
https://www.theverge.com/2024/9/30/24258147/amd-zen-5-cpu-performance-latency-bios-updates
AMD boosts Zen 5 official warrantied TDP to 105W, fixes Ryzen 9000 latency issue, launches 800-series chipsets | Tom's Hardware
https://www.tomshardware.com/pc-components/cpus/amd-boosts-zen-5-official-warrantied-tdp-to-105w-fixes-ryzen-9000-latency-issue-launches-800-series-chipsets
AGESA PI 1.2.0.2 adds a 105W option to the cTDP function for the Ryzen 5 9600X and Ryzen 7 9700X under warranty. The cTDP function allows you to control the TDP (thermal design power) from the UEFI, which is expected to improve performance, especially in multi-threaded workloads.
According to AMD, setting the TDP to 105W will improve the performance of the Ryzen 7 9700X by 10%. AMD says that the Ryzen 5 9600X and Ryzen 7 9700X have been verified at 105W since their launch, so they will not exceed their design limits, but they warn that 'if you set the TDP to 105W, please make sure you have an appropriate cooling system.'
Inter-core latency is an issue that occurred when sharing information between cores on different CCDs (Core Complex Dies) on the Ryzen 9 9950X and Ryzen 9 9900X, specifically in corner case benchmarks where two transactions were required to both read and write.
AGESA PI 1.2.0.2 cuts the number of transactions in half in this case, reducing inter-core latency, and AMD says that while this optimization won't make a noticeable difference in most applications, it could benefit certain games that make use of multi-threaded performance.
Additionally, AMD has announced motherboards featuring the X870 and X870E chiplets that will support PCIe Gen 5 for both graphics and NVMe storage, come standard with USB4, and are optimized for overclocking.
Additionally, AMD has revealed support for EXPO -ready DDR5-8000 memory. AMD has stated that DDR5-8000 may provide better results in a 1:2 memory ratio, which should improve performance in latency-sensitive games.
Related Posts:
