Qualcomm announces SoC 'Snapdragon
Qualcomm announced the Arm-based SoC ``
Qualcomm Unleashes Snapdragon X Elite: The AI Super-Charged Platform to Revolutionize the PC | Qualcomm
https://www.qualcomm.com/news/releases/2023/10/qualcomm-unleashes-snapdragon-x-elite--the-ai-super-charged-plat
The specifications of Snapdragon X Elite are as follows.
| process technology | TSMC 4nm |
| CPU | Qualcomm Oryon x 12 core clock frequency up to 3.8 GHz (single), up to 4.3 GHz (dual) |
| GPU | Qualcomm Adreno Up to 4.6TFLOPs |
| NPU | Qualcomm Hexagon, 45 TOPs Equipped with Qualcomm Sensing Hub |
| cache | Total 42MB |
| memory | Up to 64GB LPDDR5x-8533 Bandwidth: up to 136GB/s |
| Compatible storage | NVMe SSD (PCIe Gen 4) UFS4.0 SD 3.0 |
| camera | Qualcomm Spectra ISP Single camera up to 64 megapixels Dual camera up to 36 megapixels x 2 Supports 4K HDR video capture |
| modem | Snapdragon X65 5G |
| wireless connection | Qualcomm FastConnect 7800 Compatible with Wi-Fi 7, Wi-Fi 6E, Wi-Fi 6, Bluetooth 5.4 |
Qualcomm claims that the CPU performance of Snapdragon It was announced that power consumption was also reduced by 68%.
It also stated that the CPU performance was up to 60% faster and consumed 65% less power during peak performance compared to Intel's SoC Core i7-13800H.
Furthermore, when comparing multi-threaded CPU performance with Apple M2, it was 50% faster.
The GPU performance of Snapdragon
Compared to AMD Ryzen 9-7940HS, Snapdragon X Elite's GPU performance was up to 80% higher, and power consumption at peak performance was also reduced by up to 80%.
Furthermore, Qualcomm has announced that it is focusing on the AI performance of Snapdragon X Elite.
According to Qualcomm, the Snapdragon X Elite's NPU can perform 45TOPs, or 45 trillion operations per second. This is approximately three times the previous generation model, Snapdragon 8cx Gen 3. In addition, the shared memory has been doubled, and the tensor accelerator has become 2.5 times faster.
With Snapdragon
In addition, Qualcomm says it is possible to run the 13B model, a huge model with 13 billion parameters, on devices equipped with Snapdragon X Elite.
The ``Qualcomm Sensing Hub,'' which controls camera functions, microphones, wireless connections, etc., contains a chip called ``Micro NPU.''
'Snapdragon will delight in incredible power efficiency, allowing you to take your creativity and productivity to the next stage.Also, with a powerful AI experience on your device, seamless multitasking and a new intuitive user experience. It enables experiences that empower consumers and businesses to create and achieve more.'
In addition, Snapdragon X Elite is scheduled to be installed in Lenovo devices in mid-2024.
Also, at the event, Qualcomm announced the ' Qualcomm S7 Gen1 ' and ' Qualcomm S7 Pro Gen1 ' chips designed for sound devices such as wireless earphones and headphones.
Qualcomm S7 and S7 Pro Gen 1 Sound Platforms Unleash Next Level Audio Experiences | Qualcomm
Qualcomm S7 Gen1/S7 Pro Gen1 is a chip suitable for wireless earphones, headphones, and speakers, and is characterized by low power consumption and AI processing performance. According to Qualcomm, the performance is 6 times faster and the AI processing speed is 100 times faster than the previous model.
In particular, the Qualcomm S7 Pro Gen1 supports Qualcomm Expanded Personal Area Network Technology (XPAN) and low-power Wi-Fi, allowing you to continue listening to music and making calls even when you move around a very large area such as a house, building, or entire campus. It is said that it is possible. It also supports lossless sound quality up to 192kHz.
Additionally, Qualcomm announced Snapdragon Seamless , a cross-platform technology that allows multiple devices to seamlessly link and share data and peripherals across multiple operating systems.
Qualcomm Unveils Snapdragon Seamless to Allow Your Devices to Work as One | Qualcomm
https://www.qualcomm.com/news/releases/2023/10/qualcomm-unveils-snapdragon-seamless-to-allow-your-devices-to-wo
Snapdragon Seamless lets you seamlessly connect wireless mice and keyboards between PCs, phones, and tablets, drag and drop files and windows between devices, and seamlessly switch earphone connections, for example. It is said that it will become.
Microsoft, Android, Xiaomi, ASUS, Honor, Lenovo, OPPO, and others are said to be collaborating to realize Snapdragon Seamless, and it is expected to appear as early as 2023.
The keynote speech of Qualcomm Summit 2023 can be viewed below.
Snapdragon Summit 2023: Keynote Livestream - YouTube
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