``Intel is not a big threat,'' says the founder of Taiwanese semiconductor maker TSMC, also revealing that 2nm process development is progressing smoothly.



Morris Chan, founder of Taiwan-based

TSMC , one of the world's largest semiconductor manufacturers, says that TSMC is facing difficulties due to geopolitical changes surrounding TSMC and increasing competition in the semiconductor industry. I revealed that. On the other hand, Intel , which also manufactures semiconductors, claims that ``We do not consider it a major threat to TSMC.''

Morris Chang Asserts Intel Foundry Will Remain in TSMC's Shadow | Tom's Hardware
https://www.tomshardware.com/news/morris-chang-asserts-intel-will-remain-in-tsmcs-shadow



The influence of political trends in the area: Zhang Zhongmoo: A serious challenge on the Taiwanese electronics board | Industry hot spot | Industry | Business Daily

https://money.udn.com/money/story/5612/7505795

TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips
https://www.anandtech.com/show/21086/importance-of-tsmcs-oip-is-growing-collaboration-needed-for-nextgen-chips

TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion
https://www.anandtech.com/show/21091/tsmc-ecosystem-for-2nm-chip-development-is-nearing-completion

Mr. Zhang, the founder of TSMC, provided his views on the company's future challenges and strategic positioning at an event held on October 14, 2023. Mr. Chan revealed that TSMC is investing a large amount of money into improving operational efficiency and research and development, and said that TSMC is investing a large amount of money in research and development, and says that TSMC is 'despite Intel receiving a large amount of support from the US government. TSMC lags in terms of technological leadership, quality of semiconductor products, and appropriate pricing, so unless these challenges are addressed, they do not pose a real threat to TSMC.''Even if Intel Even if we overcome this and achieve success, TSMC will still have the top market share.'

On the other hand, Zhang said, 'Geopolitical tensions are inevitable for TSMC, which is based in Taiwan, and may have a negative impact on the competitive environment. On the other hand, other competitors are geopolitically better positioned than TSMC. 'Because of our competitive advantages, TSMC's semiconductor business may face more challenges in the future than ever before.'

Nevertheless, TSMC has announced that it plans to mass produce its cutting-edge technology, 2nm logic semiconductors, from the second half of 2025, and that its development is progressing smoothly. During the Open Innovation Platform forum held in October 2023, Dan Kochpacharin, TSMC's head of design infrastructure management, talked about TSMC's 2nm logic semiconductors 'N2,' 'N2P,' and 'N2X.' 'We have been developing it in collaboration with various partner companies since 2021,' the report states.



According to Kochpacharin, the 2nm logic semiconductor will be equipped with transistors manufactured using

nanosheet technology, which will behave differently than conventional transistors, FinFETs . Therefore, partner companies involved in manufacturing 2nm logic semiconductors with TSMC had to develop 2nm logic semiconductor products from scratch. Therefore, TSMC has been working with Alphawave, Cadence, Credo, eMemory, GUC, and Synopsys to create an environment for product development from around 2021. However, fields such as non-volatile memory, interface IP, and chiplet IP for 2nm logic semiconductors have not yet reached the manufacturing stage, which is a bottleneck in some chip designs.

During the event, Mr. Kotchipacharin spoke about the Open Innovation Platform (OIP), which is a collaboration between various companies to develop next-generation semiconductor technologies such as 2nm logic semiconductors and advanced packaging technologies. I argued that the program called will be very important. As of 2023, a total of 117 companies are participating in OIP.



According to Kochpacharin, participating in OIP will allow TSMC to start developing new semiconductor manufacturing technology and then participate in product development just a few months later, ultimately leading to market launch. It is estimated that the time can be reduced by approximately 15 months. Mr. Kotchipacharin said, ``In today's world, where node and chip development times are becoming longer as semiconductor manufacturing technology becomes more sophisticated, it is important for companies that have participated in TSMC and OIP to collaborate globally. ”. Additionally, the benefits of OIP include shortening time to market and improving quality, as well as reducing the burden of chip development, manufacturing, testing, and packaging on companies participating in the program. It is claimed that

In the development of semiconductor manufacturing technology, in which TSMC plays a leadership role, after the companies are divided into six alliances, TSMC assigns tasks that each company is good at, allowing them to carry out development work individually. Additionally, TSMC has been organizing a sophisticated alliance called

the 3DFabric Alliance since 2022, and is working to provide development environments to related companies and streamline the design process.

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