AMD announces Ryzen 7000 series compatible with DDR5 & PCIe 5.0 with Zen 4 architecture, scheduled to be launched in the fall of 2022
At the technology trade fair '
AMD Showcases Industry-Leading Gaming, Commercial, and Mainstream PC Technologies at COMPUTEX 2022 | AMD
https://www.amd.com/en/press-releases/2022-05-23-amd-showcases-growth-gaming-commercial-and-mainstream-mobile-and-industry
AMD Ryzen 7000 Announced: 16 Cores of Zen 4, Plus PCIe 5 and DDR5 for Socket AM5, Coming This Fall
https://www.anandtech.com/show/17399/amd-ryzen-7000-announced-zen4-pcie5-ddr5-am5-coming-fall
AMD Intros Zen 4 Ryzen 7000 CPUs and Motherboards: Up to 5.5 GHz, 15% + Performance, RDNA 2 Graphics | Tom's Hardware
https://www.tomshardware.com/news/amd-intros-zen-4-ryzen-7000-cpus-and-600-series-chipset-up-to-55-ghz-15-performance-rdna-2- igpus-pcie-5-ddr5
AMD's keynote at Computex Taipei 2022 can be found below.
AMD at Computex 2022 --YouTube
Below is a table summarizing the rough specifications of the announced Ryzen 7000 series and the comparison with the Ryzen 5000 series and Ryzen 3000 series.
| Ryzen 7000 series | Ryzen 5000 series | Ryzen 3000 series | |
| architecture | Zen 4 | Zen 3 | Zen 2 |
| Maximum core / thread | 16 cores / 32 threads | 16 cores / 32 threads | 16 cores / 32 threads |
| GPU | RDNA2 | none | none |
| Corresponding memory | DDR5 | DDR4 | DDR4 |
| Corresponding socket | AM5 | AM4 | AM4 |
| PCIe lane | PCIe 5.0 x 24 | PCIe 4.0 x 24 | PCIe 4.0 x 24 |
| Manufacturing process | CCD (CPU core die): TSMC N5 IOD (I / O die): TSMC N6 | CCD: TSMC N7 IOD: GlobalFoundries 12nmLP FinFET | CCD: TSMC N7 IOD: GlobalFoundries 12nmLP FinFET |
AMD CEO Lisa Su emphasized that the Ryzen 7000 series is 'the world's first 5nm process CPU for desktop PCs'. The CCD (CPU Core Die) with up to 16 cores is manufactured by TSMC's 5nm process, N5. In addition, the IOD (I / O die) is manufactured by TSMC's 6nm process N6, and also incorporates an RDNA generation GPU, DDR5 memory controller, and PCIe 5.0 controller.
AMD hasn't disclosed details about the Zen 4 architecture, but has revealed that it will have 1MB of L2 cache per core at this time. Also, along with the improvement of L2 cache, AMD has shown that it is aiming for a higher clock frequency, the maximum boost frequency of the 16-core equipped model of the Ryzen 7000 series is '5 GHz or more', and the single thread performance is improved by 15% or more. It is said that it was done.
In the play demo of '
CEO Sue also emphasized that the rendering benchmark using Blender showed a 31% performance improvement over
The Zen-based CPU family has supported Socket AM4 so far, but from the Ryzen 7000 series of Zen 4 architecture, it supports Socket AM5. Socket AM4 PGA1331 had a pin on the CPU side, but Socket AM5 has a pin on the motherboard side with LGA1718, so there is no pin on the CPU side. In other words, 'an accident in which the CPU also comes off when the CPU cooler is removed and the pin of the CPU breaks' does not occur.
AMD also announced the X670E, X670 and B650 as chipsets compatible with the pocket AM5. Of these, the B650 does not support overclocking, and only the M.2 slot supports PCIe 5.0.
Motherboards with the SX670E chipset will be released by ASRock, ASUS, Biostar, Gigabyte and MSI.
The Ryzen 7000 series is scheduled to be launched in the fall of 2022, but it is unknown at the time of writing the article what kind of model configuration it will be.
Related Posts:
