AMD announces products such as the Ryzen AI 400 laptop processor and the MI455X AI-specialized GPU

On January 6, 2026, AMD CEO Lisa Su delivered a keynote speech at CES 2026, one of the world's largest consumer electronics trade shows, where she announced products such as the Ryzen AI 400 series processors for PCs and the MI455X GPU for AI data centers.
AMD and its Partners Share their Vision for “AI Everywhere, for Everyone” at CES 2026 :: Advanced Micro Devices, Inc. (AMD)
AMD Expands AI Leadership Across Client, Graphics, and Software with New Ryzen, Ryzen AI, and AMD ROCm Announcements at CES 2026 :: Advanced Micro Devices, Inc. (AMD)
https://ir.amd.com/news-events/press-releases/detail/1270/amd-expands-ai-leadership-across-client-graphics-and-software-with-new-ryzen-ryzen-ai-and-amd-rocm-announcements-at-ces-2026
AMD at CES® 2026 - YouTube
The Ryzen AI 400 series is a notebook processor based on the Zen 5 architecture. It features 16 RDNA 3.5 GPU cores and a 60TOPS NPU. It delivers 1.7x the performance in creative tasks and 1.3x the performance in multi-core tasks compared to Intel's Core Ultra 9 288V .

PCs equipped with the Ryzen AI 400 series are expected to be available in the first quarter of 2026 from manufacturers such as Acer, ASUS, Dell, HP, Lenovo, Beelink, COLORFUL, LG, Mechrevo, MSI, and NEC.

In addition, the SoCs 'Ryzen AI Max+ 392' and 'AMD Ryzen AI Max+ 388' and the desktop CPU 'Ryzen 7 9850X3D' are scheduled to be released in the first quarter of 2026. In addition, a small PC for AI developers, 'Ryzen AI Halo,' will be released in the second quarter of 2026.

The company also announced the MI400 series of GPUs for AI data centers, with the MI455X being the top model and boasting 10 times the performance of the previous generation MI355X.

In addition, the company also announced the AI rack 'Helios,' which is equipped with four MI455X processors and one server CPU 'EPYC Venice,' delivering up to 3 exaflops of performance per rack.

Additionally, it was announced that the MI500 series, featuring the CDNA 6 architecture and HBM4E memory, will be released in 2027.

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