The new Mac Pro was disintegrated at once, surprisingly good maintenance was found out

On December 19, 2013, Apple released a new modelMac ProAlthough it released, too innovative design is "cool" opinion, if there is opinion that it is "garbage box" and there are voices to ridicule (yuki), etc, such as pros and cons. A repair group that decomposes such a new Mac Pro as soon as new hardware is released and exposes the situationIFixitIt is decomposing immediately. In the back of a strange design, Apple's precise hardware design seems to be hidden.

Mac Pro Late 2013 Teardown - iFixit
http://www.ifixit.com/Teardown/Mac+Pro+Late+2013+Teardown/20778

The package of the Mac Pro is black.


The Mac Pro is designed like an aluminum can.


This is the back. Power button, HDMI output, USB 3.0 terminal,ThunderboltTerminals, dual gigabit LAN and power connector are equipped.


The top surface discharges the air inside the enclosure. Unusual for Apple hardware, if you release the lock switch, the exterior cover can be easily removed.


When removing the cover it looks like this. Two boards visible in the picture are dual graphic boards.


Space is added to the right of the photo to add memory.


The memory is inserted like this and exchange is easy.


Memory made by Elpida. It supports up to 64GB of 16GB × 4.


Removing the T8 size screw removes the SSD.


SSD is made by Samsung both controller (S4LN053X01-8030) and flash memory (K9HFGY8S5C-XCK0). This is the same combination as the latest MacBook Pro · MacBook Air.



Remove the top cover.


You can see that the Mac Pro consists of three-dimensionally combining the boards.


The top cover incorporates a fan. Only this one is a fan.


Removing plastic top cover ......


Wireless LAN card "AirPort" is set.


You can access the fan by removing the three screws.


AirPort card is a familiar part of recent Apple products.


Red frame is made by BroadcomBCM 4360Wi-Fi transceiver chip, Orange frame made by BroadcomBCM 20702Bluetooth 4.0 chip, yellow frame is Skyworks SE 5516 dual band WLAN module.


Four antenna connectors on the back.


The gilded parts are antennas.


When the fan is removed, the brushless motorNidecYou can check the model number called AG720K01.


Surrounded by an orange circle is a controller chip of model number A 5940 LPT.


This is a view of the board seen from above. A huge heat sink is set to cool the CPU and GPU.


First,FCI Meg-Array connectorRemove.


Next release the plastic clamp. Behind thisAMD FireProD300 graphics chip is built in.


Then you can remove the graphics board.


It is like this when you remove 2 sheets.


The red frame of the photo is the AMD FirePro D 300 chip. Orange frame is Elpida made GDDR5 memory W2032BBBG (2GB).


While common FirePro chips are made in China, the Mac Pro chip is made in Taiwan.


The SSD slot is on the graphic board. If you use 2 graphics boards with SSD slot, will SSD also be used dual?


Subsequently, a disk typeDaughter boardEven remove it while paying attention to the flat cable.


Red frame is made by IntelBD82C602JChipset, green frame made by Texas InstrumentsLM 393.


Disassemble and disassemble ... ...


The power supply (left) and the logic board (motherboard) (right) set together with the IO panel.


Removing the logic board, the CPU is hidden there.


CPU is IntelXeon E5-1620 v2. Grease carefully peel off the CPU stuck to the heat sink.


The replacement of the CPU seems not to be so difficult. "Xeon E 5 - 2697 V 2We will expand the expectation of becoming 12 cores.


Very compact logic board. Red frame is LGA 2011 socket.


Memory slot on the back.


IO board and power supply are separated.


This is the back of the port board. The red frame is BCM57762 Gigabit Ethernet controller made by Broadcom, the green frame is made by ParadePS8401A· HDMI controller, orange frame made by IntelDSL 5520Thunderbolt controller, yellow frame made by Fresco LogicFL 1100· USB 3.0 controller.


This is the port board surface. The red frame is PEX 8723 · PCI Express switch made by PLX Technology, the yellow frame is Cirrus 4208-CRZ audio chip.


The power of the Mac Pro is 450 W and the fanless structure.


Remove the IO panel cover and disassemble it.


The Mac Pro had this part composition.


According to iFixit, the disassembly (repair) difficulty of the new Mac Pro is a relatively easy category of 10 levels "8". In order to realize compactness, most parts are modularized and easy to disassemble. Memory as well as CPU replacement is not too difficult. However, handling of some newly designed connectors and cables seems to require attention because it involves risks without a manual.