Intel finally plans to mass-produce 10 nm process products 'Ice Lake' & 'Lakefield'

Intel, which had been struggling to manufacture chips in the 10-nm process, finally revealed that it will enter mass production of the code name " Ice Lake " processor which is a 10 nm process product. In addition, we are announcing the new processor " Lakefield " integrating processors with different process rules.

2019 CES: Intel Showcases New Technology for Next Era of Computing | Intel Newsroom
https://newsroom.intel.com/news/2019-ces-intel-showcases-new-technology-next-era-computing/

2019 CES: Intel Advances PC Experience with New Platforms, Technologies and Industry Collaboration | Intel Newsroom
https://newsroom.intel.com/news/intel-advances-pc-experience-new-platforms-technologies-industry-collaboration/

◆ Ice Lake
According to CES 2019, Intel holds a presentation on the latest technology, revealed that it will be mass-produced within a couple months of the code name "Ice Lake" generation generation process and will be introduced to the market by the holiday season after late November did.

The Ice Lake processor announced this time is about power saving CPU for notebook PC. It is built on a 10nm process with a CPU adopted already, "Sunny Cove" adopted the new microarchitecture, and the 11th generation iGPU "Gen11" also announced.

Intel announces next-generation CPU architecture "Sunny Cove", built-in GPU "Gen 11", discrete GPU "Xe", etc. - GIGAZINE

"Ice Lake" CPU for notebook PC is said to correspond to LPDDR 4 × memory. Moreover, Thunderbolt 3 controller is integrated in the chip, Thunderbolt 3 correspondence of notebook PC adopted with Ice Lake processor is standardized, Thunderbolt 3 which is USB type-C compatible high-speed data transmission technology is finally expected to spread in earnest I can do it.

Intel to incorporate type-C compatible "Thunderbolt 3" into CPU and announce royalty free, how it will be useful with Thunderbolt dissemination Summary - GIGAZINE

Initially, Intel planned to introduce a processor to be manufactured at 10 nm process rule at the end of 2016, but the manufacturing was extremely difficult and the plan was postponed several times. This time, the Ice Lake generation processor will be mass-produced by the 10 nm process as the CPU for the notebook PC, and the road map will be on track again indeed two years behind.

In addition, the test of the Ice Lake generation Xeon Scalable processor manufactured by the 10 nm process is also being conducted, not only improving the performance but also strengthening the security aspect at the hardware level, while integrating the current product manufactured in the 14 nm process and Intel says it is targeting the release in 2020 as a compatible processor.

◆ Lakefield
Intel introduced "Lakefield", a new architecture that integrates three processors differently, such as high-speed CPU and power-saving CPU.

Lakefield has already announced the 3D packaging manufacturing technology " Foveros " which three-dimensionally stacks different CPUs, GPUs, memories, etc., but a hybrid CPU architecture that puts Foveros into practical use.

Lakefield is combining five "Sunny Cove" CPUs manufactured in the 10 nm process and four Atom processor based CPUs manufactured in the 22 nm process. A method combining a high-speed CPU and a power-saving CPU is an idea similar to that of ARM big.LITTLE, and we are going to do a good job of high speed and high power saving performance. In Lakefield, not only the CPU but also the GPU and I / O etc. are packaged, and the motherboard can be downsized. Lakefield will make notebook PC even faster and improve battery performance, and it seems that miniaturization will be realized.